Analysis and Simulation Capability
A multi-disciplinary professional staff is maintained at the facility, including mechanical, civil, electrical, industrial, and manufacturing engineers. Engineering offices are located both at the main Taylor Devices' facility and in Santa Monica, California. At present, some 90 U.S. patents are attributed to this staff in the fields of Shock Isolation, Vibration Control, Suspension Design, and other related energy absorption subjects. Technical reports by the staff have been published by the SAE, AISE, ASCE, NCEER, Journal of Shock and Vibration, National Science Foundation, Shock and Vibration Symposium, United States Air Force, United States Navy, and the United States Marine Corps, in addition to numerous other technical publications.
Taylor Devices provides our customers state of the art analytical capability for shock and vibration simulation. The engineering staff has performed systems definition and analysis for all branches of the Department of Defense, as well as numerous industrial customers. Our exclusive Shock Data Base of Transient Pulses includes test records of most major shock events of the past 120 years. This includes seismic effects of major earthquakes, vehicle crash histories, conventional and special weapons detonation, underwater shock, U.S. Navy shock test machine simulation, spacecraft launch transients, transport and handling shock, and generic transient shock wave forms for equipment design. Simulation software features Taylor Devices' proprietary TSIS code (Taylor Shock Isolation Simulation). TSIS provides a robust and cost effective means to analyze flexible structures subjected to shock, using finite element techniques. All known shock inputs can be accommodated, including weapons transients with their associated fast rise times. TSIS also has the ability to address virtually all types of isolation elements, including those with high degrees of non-linearity.
Computer Aided Design (CAD) capability is provided by SolidWorks® 3D CAD software and AutoCAD.